Small item dedicated plating device 'Flow-through Plater RP-2'
A series of processes such as the first plating, rinsing, and second plating can be performed in one module!
The "Flow-through Plating System RP-2" is a fully automated plating device specifically designed for small items. A series of processes such as the first plating, rinsing, and second plating can be performed within a single module, and if the processing volume increases, additional modules can be added to accommodate it. Based on this product, we also offer the "RP-2FA," which has been developed to enhance productivity and achieve labor-saving and unmanned operations through full automation. 【Features】 ■ Capable of high current density (high-speed) plating ■ Plating of fine powders (10-50μm) is possible by changing the filter ■ The amount of liquid carried in/out and the generation of gas/mist are drastically reduced compared to conventional devices ■ A series of processes such as the first plating, rinsing, and second plating can be performed within a single module ■ If the processing volume increases, additional modules can be added to accommodate it *For more details, please refer to the PDF document or feel free to contact us.
- 企業：上村工業
- 価格：Other
